The alloy is developed for 5G and EV´s where the high thermal conductivity is required. The higher the thermal conductivity gets the lesser material is to be used due to reduction of fin height in the designs. Typical applications: heat sinks, AC/DC converters and electronic housings.
The alloy is developed for 5G and EV´s where the high thermal conductivity is required. The higher the thermal conductivity gets the lesser material is to be used due to reduction of fin height in the designs.
Element | Min % | Max % |
Si |
1,8 | 4,6 |
Fe | 0,4 | 1,0 |
Cu | - | 0,15 |
Mn | - | 0,15 |
Mg | 0,2 | 0,6 |
Cr | - | 0,1 |
Ni | - | 0,1 |
Zn | - | 0,05 |
Pb | - | 0,094 |
Sn | - | 0,25 |
Ti | - | 0,05 |
Sr | - | 0,05 |
Other each max 0,05%, and total max 0,25%
Typical applications: heat sinks, AC/DC converters, and electronic housings.
Heat treatment is made at a temperature of 300 C during two hours.
Tensile strength Rm3 MPa. |
Yield strength Rp0,2 3 MPa. |
Elongation A% |
Thermal conductivity |
170-210 | 70-110 | 5,5-12,5 | 165-175* |
Heat treatment*:
150-170 | 80-100 | 6,5-9 | 181-192* |
*Heat conductivity at 100 C.